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MCL Bootcamp PPT 9 Panelization

Last update: 05/07/2025

MCL Bootcamp PPT 9 Panelization

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1. What is the primary purpose of panelization in PCB manufacturing?
To improve signal integrity during testing To enhance power distribution To secure PCBs during manufacturing, shipping, and assembly To add extra circuitry for testing
2. What does “20UP” refer to in the context of panelization?
20 types of components used on a panel 20 boards stacked vertically 20 individual boards included in one panel 20 vias per square inch on the board
3. What is the maximum panel size MCL prefers to quote, except for very small boards?
15UP 10UP 25UP 30UP
4. Why is panelization beneficial for assembly companies?
It allows for larger PCB footprints It guarantees better heat resistance It ensures design flexibility It increases throughput and improves handling efficiency
5. What is a “tab route” or “route and retain” method typically used for
Square boards only Boards without any surface mount components Round or oddly-shaped boards High voltage power supplies
6. What issue can arise from using the “route and retain” method?
Difficulty separating boards Misalignment of components Burrs left at the tab locations Reduced conductivity
7. What is the standard depth of a V-score groove in a PCB?
50% of board thickness Full-depth cut 2/3 depth total, leaving 1/3 intact 25% of board thickness
8. What are fiducials used for in the PCB assembly process?
Grounding references Cooling points Optical alignment and placement accuracy Current flow tracking
9. What is typically required on panel rails?
Gold plating Vias Fiducials and tooling holes Additional copper pour
10. When calculating a panel with V-score, what must be considered first?
The color of the solder mask The number of surface mount resistors The board’s x and y dimensions from the Gerber files The number of drill holes